FALDA^™

As electronic circuit materials, we offer products such as adhesive tapes for tape automated bonding (TAB), adhesive tapes for semiconductors, and highly thermal conductive adhesive sheets. These products are manufactured through the application of advanced film processing technologies and high-performance adhesive synthesizing technologies. With these advances in electronic circuit related technologies, the products employing them benefit from their high levels of reliability, enabling the manufacture of low-profile LSI packages, as well as finer and higher-density electronic circuits.

• KONTAK KAMI
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